Welcome to Wintop Group

Wiring Devices R&D

To support new volume production at our facilities, Wintop’s Application Design Services department develops applications solutions, leveraging the expertise of the 30+ Wintop engineers supporting customers around the globe. The group works with Wintop’s global operations to offer applications development, new product design and new product development services for a variety of industries and technologies.

1.Solid Modeling and Finite Element Analysis (FEA) Evaluation
Design Validation & Product Development
2.Packaging Integration
3.Electrical and Thermal Profiling
4.Quick-Turn Prototype
5.Electro-Mechanical Design for Electronic
6.Packaging, Electrical Interconnect and Connector applications.
7.Component Development - small metal and plastic parts and assemblies - for connectors, switches, and modules.

Capacibilty to design and develop new Electric Wiring & Function products

1. System IT Products& Electronic Products
2. ProEngineering/3D Design & Prototype
3. SoC System Design
4. Protel PCBA Layout Design
5. AutoCAD Molds and Die Design
6. IEC Dekra KEMA / LCIE NF / SGS Fimko /FCC /LVD/BS/EMC Standard Lab 7. MRP Management System
8. ISO9001 Quality Assurance System
9. 4000M2 IoT FAE Lab